Photoresist Deposition

Photoresist Deposition – Photoresist Spray – Cheersonic

Cheersonic recently launched a new photoresist ultrasonic coating system, the new UAM6000 photoresist coating system can be applied to MEMS wafers.

UAM6000 ultrasonic rotary spraying equipment can spray all corners in all directions, providing a more uniform sidewall coating in difficult-to-coat applications. Ultrasonic spraying has been used for photoresist deposition for many years, and is an effective method for semiconductor photolithography manufacturing.

Photoresist Deposition - Photoresist Spray - Cheersonic

Ultrasonic spraying technology provides an economical and efficient spraying method for MEMS wafers process. For MEMS wafers applications, Cheersonic has developed a special ultrasonic nozzle configuration to provide a more targeted spray area, which can greatly reduce overspray.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

The Company’s solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

Cheersonic’s growth strategy is focused on leveraging its innovative technologies, proprietary know-how, unique talent and experience, and global reach to further develop thin film coating technologies that enable better outcomes for its customers’ products and processes. For further information, visit