Ultrasonic Spraying Inverted Chip Flux

Ultrasonic spraying inverted chip flux. Ultrasonic spraying system for inverted chip flux. Ultrasonic spraying flux applies highly uniform flux films to the target area, resulting in virtually no spray or blockage. Our expertise in precision spraying flux enables us to develop spraying systems for high-volume inverted chip flux applications. Ultrasonic spray provides an accurate, repeatable and controllable spray solution for spraying the flux onto the contact pad. The ability to spray a very thin, uniform flux layer prevents excessive flux residue and prevents poor bottom filling, which can lead to unreliable products. Strict control of flux thickness can also prevent mold fluctuations, to avoid downtime and poor mold connection.

Benefits of using ultrasonic spraying in inverted chip packaging applications:

Highly controllable spraying avoids the cost of rework due to excessive spraying.
can control flux thickness, coating thin to 20 microns.
The uniform flux layer eliminates mold fluctuations and prevents scratches on the mold and substrate.
Ultrasonic spraying without clogging is less clean and provides high repeatability, and ultrasonic spraying performance is not affected by blockage.